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 MLX90283
BLDC Vibration Motor Driver Features and Benefits
Low supply voltage Low current consumption "Active Start" (proprietary design to address Dead Point issue) High motor efficiency High sensitivity Hall sensor Full Bridge output driver Reverse voltage protection Thermal Protection Ultra thin leadless RoHS compliant package No external components
Application Examples
BLDC vibration motors BLDC micro-motors Mobile phones Pagers Game consoles (force feedback devices) Other portable devices
Ordering Information
Part No. MLX90283 Temperature Code E (-40 to 85 C C) Package Code LD (UTQFN 6L)
1 Functional Diagram
2 General Description
The MLX90283 is a one-chip solution for driving single-coil brushless DC vibration motors. Designed in mixed signal CMOS technology, the device integrates Hall sensor with dynamic offset cancellation, control logic and full bridge output driver. Targeting vibration motor application requirements, Melexis innovates by introducing the new "Active Start" function that improves motor start-up reliability. The device is delivered in an Ultra Thin QFN package. Its 0.4mm thickness enables thin and competitive vibration motor design. This 6-pin leadless package is RoHS compliant.
3901090283 Rev 001
Page 1 of 10
Datasheet October/07
MLX90283
BLDC Vibration Motor Driver Table of Contents
1 Functional Diagram ........................................................................................................ 1 2 General Description........................................................................................................ 1 3 Glossary of Terms .......................................................................................................... 3 4 Absolute Maximum Ratings ........................................................................................... 3 5 Pin Definitions and Descriptions................................................................................... 3 6 General Electrical Specifications .................................................................................. 4 7 Magnetic Characteristics ............................................................................................... 4 8 Output Behaviour versus Magnetic Pole ...................................................................... 4 9 Detailed General Description ......................................................................................... 5 10 Unique Features............................................................................................................ 5 11 Performance Graphs .................................................................................................... 6
11.1 Magnetic parameters vs. TJ .....................................................................................................................6 11.2 Magnetic parameters vs. VDD...................................................................................................................6 11.3 RDSON vs. TJ..............................................................................................................................................6 11.4 RDSON vs. VDD ...........................................................................................................................................6 11.5 IDD vs. TJ...................................................................................................................................................6 11.6 IDD vs. VDD ................................................................................................................................................6 11.7 TFW vs. TJ .................................................................................................................................................7 11.8 TFW vs. VDD ...............................................................................................................................................7
12 Application Information................................................................................................ 7 13 Application Comments ................................................................................................. 7 14 Standard information regarding manufacturability of Melexis products with different soldering processes........................................................................................... 8 15 ESD Precautions ........................................................................................................... 8 16 LD Package Information ............................................................................................... 9 17 Disclaimer.................................................................................................................... 10
3901090283 Rev 001
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Datasheet October/07
MLX90283
BLDC Vibration Motor Driver
3 Glossary of Terms
BLDC Full Bridge (H-Bridge) MilliTesla (mT), Gauss Freewheel Dead Point Brush-Less Direct Current Two push-pull output drivers enabling bidirectional current flow through the connected load Units of magnetic flux density: 1mT = 10 Gauss Period of time while the rotor continues spinning after disengagement from the drive mechanism, i.e. after switching off the coil output drivers in a BLDC motor. Rotor angular position where the motor torque is zero
4 Absolute Maximum Ratings
Parameter Supply Voltage Continuous Output Current (1) Peak Output Current Magnetic Flux Density Operating Temperature Range Storage Temperature Range Junction Temperature Single-layer (1S0P) PCB Power dissipation Multi-layer (1S2P) PCB ESD Sensitivity (2) Table 1: Absolute maximum ratings Symbol VDD IOUT IOUTp B TA TS TJ PD PD Value -5 to 5 150 250 Unlimited -40 to 85 -65 to 150 125 500 1600 4000 Units V mA mA mT C C C mW mW V
Note 1: Value of continuous output current using recommended land pattern - Exposed pad connected to PCB substrate with solder Note 2: Human Body Model according JESD22-A114 standard - 100pF capacitor discharged through 1.5k resistor into each pin.
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability.
5 Pin Definitions and Descriptions
Pin Pin Name Function 1 VDD Power Supply 2 NC Not Connected 3 OUT1 Coil Driver 1 4 GND Ground 5 OUT2 Coil Driver 2 6 NC Not Connected Table 2: Pin definitions and descriptions
Note : Exposed Pad connected to ground
3901090283 Rev 001
Page 3 of 10
Datasheet October/07
MLX90283
BLDC Vibration Motor Driver 6 General Electrical Specifications
DC Operating Parameters TJ = 25 C, VDD = 3V (unless otherwise specified) Parameter Supply Voltage Supply Current Output ON Resistance ( Full Bridge) "Active Start" Detection Period "Active Start" Frequency "Active Start" Duty Cycle Freewheel Delay Sensing Propagation Delay Thermal Protection Shutdown Thermal Protection Release Package Thermal Resistance Table 3: Electrical specifications
Note 3: The Active Start Frequency is determined as follow: Where: 1 FAS = TAS_FW is the Active Start forward driving duration TAS _ FW + TAS _ RV TAS_RV is the Active Start reverse driving duration Note 4: The Active Start Duty Cycle represents the percentage of forward driving compared to the total Active Start period: Where: TAS _ FW D AS (%) = TAS_FW is the Active Start forward driving duration TAS _ FW + TAS _ RV TAS_RV is the Active Start reverse driving duration Note 5: The sensing propagation delay represents the delay from the magnetic field change (B>BOP or Bo
Symbol VDD IDD RON TON FAS DAS TFW TSENSE TSD TREL RTHj-a
Test Conditions Operating No load between OUT1/OUT2 TJ = 25C TJ = 85C Fixed magnetic field direction See Note 3 See Note 4 See Note 5 See Note 6 See Note 6 Single layer (1S0P) PCB Multi-layer (1S2P) PCB
Min 1.8
75 8 60
Typ 3 2.1 2.3 2.7 150 13 87.5 92 36 170 160 250 78
Max 3.6 3.2 4 5 170 20 140
Units V mA ms Hz % s s C C C/W
7 Magnetic Characteristics
DC Operating Parameters TJ = 25 C, VDD = 3V (unless otherwise specified) Parameter Symbol Operate point BOP Release point BRP Hysteresis BHYST Table 4: Magnetic specifications Min 0 -5 1 Typ 2 -2 4 Max 5 0 8 Units mT mT mT
o
8 Output Behaviour versus Magnetic Pole
Parameter Test conditions OUT1 South pole B > BOP High North pole B < BRP Low Table 5: Output behaviour versus magnetic pole OUT2 Low High
Note : The magnetic pole is applied facing the branded side of the package
3901090283 Rev 001
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Datasheet October/07
MLX90283
BLDC Vibration Motor Driver
9 Detailed General Description
The MLX90283 is a complete one-chip solution for driving BLDC vibration motors. As a result of the low output resistance of the full bridge output and the low supply current, the IC provides high driving performance and increased motor efficiency. The built-in reverse voltage protection avoids any damage in case the supply voltage is accidentally reversed. The UTQFN package requires only 3mm PCB surface. The 0.4mm thickness enables production of very small and thin vibration motors. The package also includes an Exposed Pad for enhanced thermal performance.
2
10 Unique Features
The new proprietary design from Melexis "Active Start" provides an appropriate solution against the major source of vibration motor start-up reliability issue: rotor stalled close to the dead point. When the rotor position is close to the dead point the force produced by the stator is not sufficient to overcome the mechanical friction. The rotor is stalled and cannot start rotating without an additional external force. The "Active Start" function is activated if the magnetic pole sensed by the device does not change for more than 110ms typical. In this mode the device effectively decreases the mechanical friction by applying a special shaking signal to the motor coil which helps to overcome the dead point position. The function is immediately deactivated after a change in the magnetic pole sensed by the device. A BLDC vibration motor is designed and optimised for one rotation direction (clockwise or counter-clockwise). Rotating in the reverse direction inevitably leads to a reduction of the motor performance as loss in revolution per minute and higher current consumption. The Active Start favours the normal rotation direction to always ensure the highest motor performance. Vibration motors are predominantly used in battery-powered applications. Low power consumption is a critical characteristic to ensure longer operation time. Based on the "Freewheel" principle, the MLX90283 features a special motor driving technique to lower the motor current consumption. With optimized position of the Hall sensor in the vibration motor, the Freewheel event occurs only when the motor torque is low. Cutting this part of the motor torque does not affect the rotation speed while the motor current consumption is reduced proportionally to the rotation speed. This simple and efficient system directly improves the motor efficiency. The Freewheel principle enables to reach high rotation speed with lower power consumption than usual.
3901090283 Rev 001
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Datasheet October/07
MLX90283
BLDC Vibration Motor Driver 11 Performance Graphs
11.1 Magnetic parameters vs. TJ
5 4 3 2 Magnetic field (mT) 1 0 -1 -2 -3 -4 -5 -40 -20 0 20 40 Tj (C) 60 80 100 120 Magnetic field (mT) Bop, VDD=3V Brp, VDD=3V 3 2 1 0 -1 -2 -3 -4 -5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VDD (Volts)
11.2 Magnetic parameters vs. VDD
5 4 Bop, Tj=-40C Bop, Tj=25C Bop, Tj=125 C Brp, Tj=-40C Brp, Tj=25C Brp, Tj=125 C
11.3 RDSON vs. TJ
5 VDD = 1.8V VDD = 3V VDD = 3.6V 4
11.4 RDSON vs. VDD
5 Tj = -40C 4 Tj = 25C Tj = 85C Tj = 125 C
Ron (ohms)
2
Ron (ohms) -40 -20 0 20 40 Tj (C) 60 80 100 120
3
3
2
1
1
0
0 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VDD (Volts)
11.5 IDD vs. TJ
4 VDD = 1.8V VDD = 3V 3 VDD = 3.6V
11.6 IDD vs. VDD
4
3
IDD (mA)
2
IDD (mA)
2 Ta = -40 C Ta = 25 C
1
1
Ta = 85 C Ta = 125C
0 -40 -20 0 20 40 Tj ( C) 60 80 100 120
0 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VDD (Volts)
3901090283 Rev 001
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Datasheet October/07
MLX90283
BLDC Vibration Motor Driver
11.7 TFW vs. TJ
150 140 130 Freewheel duration (us) 120 110 100 90 80 70 60 50 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VDD (Volts) Tj = -40 C Tj = 25 C Tj = 85 C Tj = 125C Freewheel duration (us)
11.8 TFW vs. VDD
150 140 130 120 110 100 90 80 70 60 50 -40 -20 0 20 40 Tj ( C) 60 80 100 120 VDD = 1.8V VDD = 3V VDD = 3.6V
12 Application Information
13 Application Comments
For proper operation, the power supply should be decoupled by a 22nF ~ 100nF capacitor. In order to protect the device against over voltages spikes on the VDD line, a zener diode with VZ < 5V should be connected between VDD and ground, thus limiting the spikes below the absolute maximum rating.
3901090283 Rev 001
Page 7 of 10
Datasheet October/07
MLX90283
BLDC Vibration Motor Driver
14 Standard information regarding manufacturability of Melexis products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD's (Surface Mount Devices) * IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2)
*
Wave Soldering SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * * EN60749-20 Resistance of plastic- encapsulated SMD's to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD's (Through Hole Devices) * EN60749-15 Resistance to soldering temperature for through-hole mounted devices
Solderability SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * EIA/JEDEC JESD22-B102 and EN60749-21 Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
15 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901090283 Rev 001
Page 8 of 10
Datasheet October/07
MLX90283
BLDC Vibration Motor Driver
16 LD Package Information
1.50 BSC 0.75 BSC
Notes: 1. All dimensions are in millimeters. 2. The terminal #1 identifier and terminal numbering convention shall conform JEDEC publication 95 SPP-002. Details of terminal #1 identifier are optional, but must be located within the zone indicated. The terminal #1 identifier may be marked feature. 3. Depopulation is possible in a symmetrical fashion. 4. Pad length applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the pad length should not be measured in that radius area.
SEATING PLANE Terminal Tip 0.50 BSC
INDEX AREA
see note 2
Marking: 1st Line : .83 "." (dot) - used to show the 1st pin 83 - Name of the device (MLX90283)
0.25+/-0.05
see note 4
R0.20
INDEX AREA
see note 2
2nd Line : YWW Y - Year (last digit) WW - Calendar Week
EXPOSED PAD
1.10+/-0.10
Hall plate location
0.2 MIN 0.25+/-0.05 6 5 4 0.30+/-0.05
Land Pattern
Notes: 1. All dimensions are in millimeters.
Notes:
0.005
1. All dimensions are in millimeters.
0.019
2. Top view is represented. Package pads and outline are for reference.
0.05 MIN
see note 4
0.15 MIN
see note 3
2. Top view is represented. Terminals and exposed pad are for illustration only. 3. Hall Plate position in X and Y axis relative to package center
3. Recommended minimal distance to prevent solder bridging. 4. Recommended distance for good solder filleting. 5. To enable thermal and electrical characteristics enhancement, the Exposed Pad must be connected to the PCB substrate with solder. 6. Exposed pad land pattern should be extended whenever possible. Therefore, its width is not limited whereas its height should respect the minimal distance as mentioned in note 3.
Package line
1
2
3
Package line
7. Land pattern based on package supplier's specification.
0.24+/-0.02
LD package dimensions - Blue Corresponding land pattern - Green
3901090283 Rev 001
0.00 0.05
SEATING PLANE
Page 9 of 10
Datasheet October/07
MLX90283
BLDC Vibration Motor Driver
17 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis' rendering of technical or other services. (c) 2005 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia:
Phone: +32 1367 0495 E-mail: sales_europe@melexis.com
America:
Phone: +1 603 223 2362 E-mail: sales_usa@melexis.com
ISO/TS 16949 and ISO14001 Certified
3901090283 Rev 001
Page 10 of 10
Datasheet October/07


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